摘要：美国联社驻北京记者2025年9月18日报道，中国华为技术有限公司周四表示，未来两年将推出全球性能最强大的人工智能计算集群。尽管依赖性能较低的国产半导体，该公司仍力求超越全球科技领军企业。
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2025年7月华为在上海世界人工智能会议上的展台展出华为的最新产品与解决方案
美国联社驻北京记者2025年9月18日报道，中国华为技术有限公司周四表示，未来两年将推出全球性能最强大的人工智能计算集群。尽管依赖性能较低的国产半导体，该公司仍力求超越全球科技领军企业。
由于美国对销往中国的产品（包括最先进的芯片）实施限制，中国正加紧自主技术研发。与此同时，有报道称，中国政府已要求企业停止采购部分美国芯片，旨在推动中国成为全球科技领军者，并降低对进口零部件的依赖。
作为自主技术研发的领军企业，华为在上海举行的年度客户大会上表示，将于2026年底和2027年底推出新型“超级计算单元。“超级计算单元”是计算机行业术语，指一组相互连接的计算机；对华为而言，该单元将整合数千枚芯片的算力。
专业爱好者拍摄华为展出的昇腾380超节点与Atlas 950超级计算单元
人工智能领域正迅速发展，且是中美竞争激烈的领域，运行该领域的模型需要庞大的算力支持。
福雷斯特研究公司的科技分析师查理·戴表示：“这是一个重要的里程碑。它表明，在面临出口限制的情况下，（中国科技行业）正更大力地推动自主创新和抗风险能力建设。”
华为宣布，计划在未来两年推出Atlas 950和Atlas 960超级计算单元。华为表示，将数十个该公司品牌化命名的“超级计算单元”连接起来，可组成全球性能最强大的“超级计算集群”。
华为在新闻稿中称，根据行业内其他企业的产品路线图，Atlas 950和Atlas 960是目前全球性能最强的超级计算单元，且未来数年仍将保持这一领先地位。
为阻挠中国公司人工智能发展，美严格限制包括英伟达在内的先进半导体对华出口
中国企业面临的挑战是，在无法获取全球最先进半导体（尤其是来自美国市场领军企业英伟达的产品）的情况下，如何跟上开放人工智能、谷歌等美国竞争对手的步伐。而解决方案是使用更多数量的芯片，并研发能让这些芯片高效协同工作的架构。
根据华为提供的会议实录，该公司现任轮值董事长徐直军在客户大会上表示：“我们的战略是打造全新的计算架构，研发超级计算单元和超级计算集群，以可持续的方式满足长期的算力需求。”
总部位于中国南方城市深圳的华为还宣布，计划在未来三年内推出昇腾系列新型人工智能芯片。Atlas 950和Atlas 960超级计算单元将基于分别于2026年和2027年推出的昇腾950和昇腾960芯片打造。按计划，昇腾970（Ascend 970）芯片可能于2028年推出。
华为轮值董事长徐直军公布华为AI全战略
How Huawei plans to outperform global tech leaders with less powerful chips. BEIJING (AP). September 18, 2025.
China’s Huawei Technologies said Thursday that it would roll out the world’s most powerful AI computing clusters over the next two years as it seeks to outperform global leaders despite relying on less powerful domestic semiconductors.
China is racing to develop its own technology as America restricts what can be sold to China, including its most advanced chips. At the same time, the Chinese government has reportedly told companies to stop buying some American chips as it seeks to transform China into a global tech leader and one that is less reliant on imported components.
Huawei, at the forefront of efforts to develop home-grown technology, said at an annual customer event in Shanghai that it would launch new “superpods” in late 2026 and late 2027. That’s computer industry lingo for a group of interconnected computers that, in Huawei’s case, combines the power of thousands of chips.
That immense power is needed to run models in the burgeoning field of artificial intelligence, an area of hot competition between the U.S. and China.
“This is a significant milestone,” said Charlie Dai, a technology analyst at the research firm Forrester Research. “It signals a stronger push toward self-reliance and resilience in the face of export restrictions.”
Huawei announced plans to release the Atlas 950 and 960 superpods over the next two years. Dozens of the “SuperPoDs,” as Huawei brands them, could be connected to form what Huawei said would be the world’s most powerful “SuperClusters.”
The 950 and 960 are the most powerful superpods in the world and would remain so for years to come, a company news release said, based on product road maps from others in the industry.
The challenge for China is how to keep pace with American competitors such as Open AI and Google without access to the world’s most powerful semiconductors, notably those from America’s market-leading Nvidia. The answer has been to use many more chips and develop the architecture to make them work well together.
“Our strategy is to create a new computing architecture, and develop computing SuperPoDs and SuperClusters, to sustainably meet long-term demand for computing power,” Eric Xu, the current rotating chairman of Huawei, told the customer conference, according to a transcript provided by the company.
Huawei, based in Shenzhen in southern China, also announced plans to launch new AI chips in its Ascend series over the next three years. The Atlas 950 and 960 superpods would be based on the Ascend 950 and 960 chips, due out in 2026 and 2027. A planned Ascend 970 chip could follow in 2028.
来源：读行品世事一点号
