摘要：由 IEEE 中国联合会、IEEE 北京分会、四川省电子学会及武汉理工大学联合主办，电子科技大学长三角研究院（湖州）承办的2026 IEEE 第十八届国际固态和集成电路技术会议（2026 IEEE 18th International Conference o

第十八届IEEE

国际固态和集成电路技术会议

•

2026年10月27日-30日

中国 · 杭州

会议简介

由 IEEE 中国联合会、IEEE 北京分会、四川省电子学会及武汉理工大学联合主办，电子科技大学长三角研究院（湖州）承办的 2026 IEEE 第十八届国际固态和集成电路技术会议（2026 IEEE 18th International Conference on Solid-state and Integrated Circuit Technology, ICSICT 2026），定于2026年10 月27日至30日在杭州举办。作为中国每两年一届的顶尖学术盛会，ICSICT是固态器件与集成电路领域规模最大、影响力最深远的国际会议之一。

本届会议聚焦固态数字集成电路与系统设计、模拟电路、器件研发、工艺技术等核心方向，为期四天的议程将通过口头报告、海报展示、专题研讨及特色活动等多元形式，全面呈现全球该领域的前沿突破与创新成果。会议以“推进集成电路技术进步、促进产学研深度融合”为宗旨，届时将有来自世界各国和地区学术界、产业界的 500 余位杰出代表齐聚杭州，共话技术发展趋势，探索产业应用前景。

ICSICT

Co-sponsored by

ICSICT

Technically Co-sponsored by

ICSICT

Hosted by

ICSICT

Supported by

ICSICT

Media Partner

会议组委会

↓ 上下滑动查看完整组委会名单 ↓

Life Honorary Chair

Yangyuan Wang,Peking University, China

Advisory Committee Co-Chairs

Ting-Ao Tang, Fudan University, China

Cor Claeys, Proximus, Belgium

Mengqi Zhou, IEEE China Council, China

General Chairs

Jan Van der Spiegel, University of Pennsylvania, USA

Bin Zhao, IEEE EDS, USA

Francois Rivet, University of Bordeaux, France

Amara Amara, International Innovation Institute, Beihang University, Hangzhou Campus, China

General Co-Chairs

Ning Xu, Wuhan University of Technology, China

Cheng Zhuo, Zhejiang University, China

Yuehang Xu, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Gaofeng Wang, Hangzhou Dianzi University, China

Technical Program Committee Chairs

Haruo Kobayashi, Gunma University, Japan

Ming Li, Peking University, China

Bo Zhang, University of Electronic Science and Technology of China, China

Yi Zhao, Huada Semiconductor, China

Technical Program Committee Co-Chairs

Bei Yu, The Chinese University of Hong Kong, China

Zheng Wang, University of Electronic Science and Technology of China, China

Fakhrul Zaman Rokhani,Universiti Putra Malaysia, Malaysia

Ling Zhang, Zhejiang University, China

Yuchao Yang, Peking University, China

Jing Jin, Shanghai Jiao Tong University, China

Wentong Zhang,

Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Local Arrangement Chair

Letian Huang, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Subcommittee Chairs

Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Wentong Zhang, University of Electronic Science and Technology of China, China

Jing Jin, Shanghai Jiao Tong University, China

Yuchao Yang,Peking University, China

Subcommittee Co-Chairs

Hailong Jiao, Peking University, China

Zheng Wang, University of Electronic Science and Technology of China, China

Jin Wei,

Zhihao Yu, Nanjing University of Posts and Telecommunications, China

Special Session Chair

Haimeng Huang, University of Electronic Science and Technology of China, China

Tutorial Chair

Wei Mao, Xidian University, China

Industry Liaison Chairs

Sylvain Eimer, Truth Equipment, China

Preet Yadav, NXP Semiconductors, India

Publicity Co-Chairs

Caoyu Li,Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Chaoyue Zheng,

Publication Committee Chair

Mengqi Zhou, IEEE China Council, China

Publication Committee Co-chairs

Lobna A. Said, Nile University, Egypt

Guoqing Deng, Sichuan Institute of Electronics, China

Treasurer

Jianhong Zhou, Xihua University, China

Secretary General

Tiantian Han, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

征稿主题

Theme 1: Digital & System Level IC

Chair: Yuchao Yang, Peking University, China

Co-Chair: Hailong Jiao

Track 1: Digital Architectures & Systems

Chair:

Zhiyi Yu, Sun Yat-sen University, China

Co-Chairs:

Yaoyu Tao, Peking University, China

Hongyang Jia, Tsinghua University, China

Track 2: Digital Circuits

Chair:

Yongpan Liu, Tsinghua University, China

Co-Chairs:

Yanan Sun, Shanghai Jiao Tong University, China

Fengbin Tu, Hong Kong University of Science and Technology, China

Track 3: Design Methodology & EDA

Chair:

Jun Yang, Southeast University, China

Co-Chairs:

Yibo Lin, Peking University, China

Yu Li, Zhejiang University, China

Theme 2: Analog

Chair: Jing Jin, Shanghai Jiao Tong University, China

Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China

Track 4: RF & Wireless

Chair:

Keping Wang, Tianjin University, China

Co-Chairs:

Jian Pang, Shanghai Jiao Tong University, China

Kai Tang,Hunan University, China

Track 5: Wireline

Chair:

Xiaoyan Gui, Xi'an Jiaotong University, China

Co-Chairs:

Bingyi Ye, East China Normal University, China

Yuekang Guo, Shanghai Jiao Tong University, China

Track 6: General Analog

Chair:

Lin Cheng, University of Science and Technology of China, China

Co-Chairs:

Junmin Jiang, Southern University of Science and Technology, China

Ang Hu, Huazhong University of Science and Technology, China

Theme 3: Devices

Chair: Wentong Zhang, University of Electronic Science and Technology of China, China

Co-Chair:Jin Wei, Peking University, China

Track 7: CMOS Logic Devices & Sensors

Chair:

Heng Wu, Peking University, China

Co-Chairs:

Wang Kang, Beihang University, China

Xiaosheng Zhang, University of Electronic Science and Technology of China, China

Track 8: Power Devices & Power IC

Chair:

Long Zhang, Southeast University, China

Co-Chairs:

Jiafei Yao, Nanjing University of Posts and Telecommunications, China

Zekun Zhou, University of Electronic Science and Technology of China, China

Track 9: Device Reliability & Security

Chair:

Mengyuan Hua, Southern University of Science and Technology, China

Co-Chairs:

Sen Huang, Institute of Microelectronics of Chinese Academy of Sciences, China

Zhao Qi, University of Electronic Science and Technology of China, China

Theme 4: Process & Technologies

Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Co-Chair: Zhihao Yu,

Track 10: Semiconductor Process Technologies

Chair:

Bobo Tian, East China Normal University, China

Co-Chairs:

Min Liao, Xidian University, China

Li Zhu, Nanjing University of Posts and Telecommunications, China

Track 11: Optoelectronics and Silicon Photonics Integration

Chair:

Linfeng Sun, Beijing Institute of Technology, China

Co-Chairs:

Ming Xu, Huazhong University of Science and Technology, China

Yuanfang Yu, Nanjing University of Posts and Telecommunications, China

Track 12: Packaging Technologies

Chair:

Jun Zhang,Nanjing University of Posts and Telecommunications, China

Co-Chairs:

Shenyang Mo,NARI Semiconductor R&D Center, China

Pengfei Zhao, Nanjing University of Posts and Telecommunications, China

投稿方式

投稿作者需按照论文模板撰写论文，提交至少3页的英文文章，被录用文章将收录于会议论文集。

或前往easychair投稿

https://easychair.org/conferences/?conf=icsict2026

投稿要求

论文模板

重要时间

征稿截止日期：2026年6月25日

录用通知日期：2026年7月25日

组织特别分会

ICSICT 2026组委会邀请专家学者积极组织特别分会，展示自己的先进研究成果！

有意组织的学者请在2026年2月1日前将提案发送至会议邮箱。（ieeeicsict@outlook.com）。

提案模板

通过下方链接下载：

相聚杭州

杭州市，坐落于风景如画江浙腹地，是一座以永恒之美和丰富文化遗产闻名的城市。

杭州最著名的景点之一是西湖，它被联合国教科文组织列为世界遗产。除此之外，京杭大运河、灵隐寺、钱塘江以及新兴升起的电子商务产业，都让这座富有历史底蕴的城市散发新的光芒。

ICSICT 2026组委会诚挚邀请您参与会议，于金秋10月相约在这座美丽的城市！

会议秘书：钟女士

会议邮箱：

icsict2026@csj.uestc.edu.cn

ieeeicsict@outlook.com

来源：半导体行业观察一点号